Development of a wafer-level burn-in test socket for fine-pitch BGA interconnect

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1147-1151

  Qiao, Q ^a   Gordon, M H ^a   Schmidt, W F ^a   Li, Li, ^a   Ang, S S ^a   Huang, Biao ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; PLASTIC DEFORMATION; SOLDERING ALLOYS; THIN FILMS;

BALL GRID ARRAY INTERCONNECT; CONTACT BEAM STRUCTURE; COPPER THIN FILM BEAM STRUCTURE; NONLINEAR FINITE ELEMENT MODEL; WAFER LEVEL BURN IN TEST SOCKET;

ELECTRIC CONNECTORS;

EID: 0034479575     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)