Processing thick multilevel polyimide films for 3-D stacked memory

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 2, 1999, Pages 189-199

  Caterer, Michael D ^a,b   Daubenspeck, Timothy H ^a,b  

^a IBM MICROELECTRONICS   (United States)

^b Irvine Sensors Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; INTERCONNECTION NETWORKS; MULTILAYERS; PHOTORESISTS; PLASTIC FILMS; POLYIMIDES; THICK FILMS;

EDGE-BEAD EFFECTS; THICK MULTILEVEL POLYIMIDE FILMS;

ELECTRONICS PACKAGING;

EID: 0033336780     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.763191     Document Type: Article

References (5)

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2. J. A. MinahanA. Pepe, R. Some, and M. Suer, "The 3-D stack in short form," in Proc. 42nd Electron. Comp. Technol. Conf., 1992, pp. 340-344.
3. C. Feger and H. Franke"Polyimides in high performance electronics packaging and optoelectronic applications," in M. K. Ghosh and K. L. Mittal, Eds., Polyimides: Fundamentals and Applications. New York: Marcel Dekker, 1996, pp. 759-814
4. P. Geldermans and C. Feger"Determination of stress in biaxially strained, free standing films," J. Plast. Film Sheet, vol. 9, p. 52, 1993
5. "Method of etching polyimide U.S. Patent 4353778, 1982.