Thermal cycling and thermal shock for FCOB testing

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Agarwal, Rakesh K ^a   Tuchscherer, Larry ^a   Cui, Helen ^a   Jain, Ritesh ^a   Torri, Thomas ^a   Baxter, Scott ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTEGRATED CIRCUIT TESTING; LIFE CYCLE; SOLDERED JOINTS; STATISTICAL METHODS; THERMAL CYCLING; THERMAL EFFECTS;

FLIP CHIP ON BOARD (FCOB) PACKAGES; THERMAL SHOCK;

ELECTRONICS PACKAGING;

EID: 0342732956     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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4. Pecht, M. G., et at., Electronic Packaging Materials and Their Properties, CRC Press, 1999.
5. Popelar, S.F., Erickson, C.A., and Yeh, S., "A Methodology for Generating Thermal Cycling Fatigue Models for Flip Chip Solder Alloys", Proceedings of the 1996 International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium, Sunnyvale, CA, Feb. 1996, pp. 118-125.
6. Popelar, S.F., "Creep Characterization of Solder Alloys", Final Report for the Low Cost Flip Chip Consortium, ARPA Agreement MDA 972-95-3- 0031, 1997.
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8. Wiebull++™ 5.0, ReliaSoft Corporation, Tuson, AZ, 1997.
9. Wong, B., Helling, D.E., and Clark, R.W., "A Creep-Rupture Model for Two-Phase Eutectic Solder", IEEE Transactions of CHMT, Vol. 11, No. 3 (1988), pp. 284-290.