The effect of grain boundary characteristics on microstructure and stress void evolution in electroplated and sputtered Cu films

Materials Science Forum

Volumn 426-432, Issue 4, 2003, Pages 3481-3486

  Joo, Young Chang ^a   Hwang, Soo Jung ^a   Park, Hyun ^a  

^a Seoul National University   (South Korea)

Author keywords

Copper; Diffusion; Electroplating; Microstructure; Sputtering; Stress voiding; Thin films

Indexed keywords

COPPER; DIFFUSION; ELECTROPLATING; GRAIN BOUNDARIES; MICROSTRUCTURE; MORPHOLOGY; SPUTTERING;

STRESS VOID EVOLUTION;

THIN FILMS;

EID: 0038266419     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.426-432.3481     Document Type: Conference Paper

References (18)

1. P. Borgesen, J. K. Lee, R. Gleixner and C. Y. Li: Appl. Phys. Lett. Vol. 60 (1992), p. 1706
2. J. A. Nucci, Y. Shacham-Diamand and J. E. Sanchez, Jr.: Appl. Phys. Lett. Vol. 66 (1995), p. 3585
3. S. Kordic, R. A. M. Wolters and K. Z. Troost: J. Appl. Phys. Vol. 74 (1993), p. 5391
4. J. A. Nucci, R. R. Keller, D. P. Field and Y. Shacham-Diamand: Appl. Phys. Lett. Vol. 70 (1997), p. 1242
5. S. Kordic, R. A. Augur, A. G. Dirks and R. A. M. Wolters: Appl. Surf. Sci. Vol. 91 (1995), p. 197
6. J. A. Nucci, R. R. Keller, J. E. Sanchez, Jr. and Y. Shacham-Diamand: Appl. Phys. Lett. Vol. 69 (1996), p. 4017
7. R. R. Keller, C. E. Kalnas and J. M. Phelps: J. Appl. Phys. Vol. 86 (1999), p. 1167
8. J. P. Lokker, G. C. A. M. Janssen and S. Radelaar: Microelectronic Engineering Vol. 50 (2000), p. 257
9. D. Weiss, Ph. D. Dissertation. Max Plank Institute fur Metallforschung, Stuttgart, Germany (2000)
10. J. Koike, M. Wada, M. Sanda and K. Maruyama: Appl. Phy. Lett. Vol. 6 (2002), p. 1017
11. A. Sekiguchi, J. Koike, S. Kamiya, M. Saka and K. Maruyama: Appl. Phys. Lett. Vol. 79 (2001), p. 1264
12. S. -J. Hwang, H. Park, J.-H. Lee, K. H. Oh and Y. -C. Joo: Mater. Sci. Forum Vol. 408-412 (2002), p. 1651
13. D. Weiss, O. Kraft and E. Arzt: J. Mater. Res. Vol. 17 (6) (2002), p. 1363
14. D. Wolf and K. L. Merkle: Materials Interfaces; Atomic-Level Structure and Properties, edited by D. Wolf and S. Yip (Chapman and Hall, London, 1992, pp. 87-150)
15. M. D. Thouless: Acta metal. Mater. Vol. 41(4) (1993), p. 1057
16. F. Y. Genin, W. W. Mullins and P. Wynblatt: Acta metall. Mater. Vol. 41(12) (1993), p. 3541
17. F. Y. Genin: Acta metall. Mater. Vol. 43(12) (1995), p. 4289
18. S. H. Kang, Y. S. Obeng, M. A. Decker, M. Oh, S. M. Merchant, S. K. Karthikeyan, C. S. Seet, and A. S. Oats: J. Electronic Mater. Vol. 30(12) (2001), p. 1506