SOLDER BUMP FABRICATION BY ELECTROCHEMICAL METHOD FOR FLIP CHIP INTERCONNECTION.

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1981, Pages 149-155

  Kawanobe, T ^a   Miyamoto, K ^a   Inaba, Y ^a   Okudaira, H ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0019680001     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)