Low cost wafer bumping processes for flip chip applications (electroless nickel-gold/stencil printing)

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 18-33

  Strandjord, Andrew J G ^a   Popelar, Scott F ^a   Erickson, Curt A ^a  

^a IC Interconnect   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FLIP CHIP DEVICES; NICKEL; PROCESS CONTROL; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERING;

BALL GRID ARRAY; SOLDER BUMPING; THERMAL REFLOW; UNDER BUMP METALLURGY; WAFER BUMPING;

ELECTROLESS PLATING;

EID: 0033316204     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)