The impact of single-wafer processing on semiconductor manufacturing

IEEE Transactions on Semiconductor Manufacturing

Volumn 16, Issue 2, 2003, Pages 96-101

  Singh, Rajendra ^a   Fakhruddin, Mohammed ^a   Poole, Kelvin F ^a  

^a AMRL   (United States)

Author keywords

Furnaces; Integrated ciucuit manufacture; Leakage currents; Rapid thermal processing; Reliability; Yield optimization

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); LEAKAGE CURRENTS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR GROWTH; SILICON WAFERS; SURFACE CLEANING;

SINGLE-WAFER PROCESSING (SWP);

MICROELECTRONICS;

EID: 0037954437     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2003.810941     Document Type: Article

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