Agile fab concepts for cost effective and QTAT mini fab

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2001, Pages 7-10

  Mikata, Yuuichi ^a   Mitsutake, Kunihiro ^a   Arikado, Tsunetoshi ^a   Okumura, Katsuya ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AGILE MANUFACTURING SYSTEMS; COMPUTER SIMULATION; DRY ETCHING; ELECTROPLATING; ION IMPLANTATION; LITHOGRAPHY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

RAW PROCESS TIME (RPT); SEMICONDUCTOR MANUFACTURING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0035165639     PISSN: 1523553X     EISSN: None     Source Type: Journal    
DOI: 10.1109/ISSM.2001.962902     Document Type: Article

References (6)

1. Determing capacity loss from operational and technical deployment practices in a semiconductor manufacturing line
2. Stencil mask ion implantation technology for high performance MOSFETs
3. Mini fab and clean technology
4. Novel coating apparatus using nozzle -scan technique
5. Electroplating performance enhancement by controlling resistivity of electrolyte with porous materials for advanced Cu metallization
6. A novel compact ECD tool for ULSI Cu metallization