Manufacturing in the 21st century-new concept for 300mm fab

IEEE Symposium on VLSI Circuits, Digest of Technical Papers

Volumn , Issue TECHNOLOGY SYMP., 2001, Pages 1-4

  Koike, A ^a  

^a Trecenti Technologies Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

LIFE CYCLE; OPTIMIZATION; PROCESS CONTROL; SEMICONDUCTOR DEVICE MODELS;

SINGLE WAFER PROCESSING;

WSI CIRCUITS;

EID: 0034789865     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. A new fab concept in the 300mm wafer era
2. Trends in semiconductor device production lines and processing equipment
3. A new LSI manufacturing scheme in the large-diameter wafer era for super-quick TAT development and volume production