-
1
-
-
0035173259
-
max HBT and ASIC-compatible CMOS using copper interconnect
-
max HBT and ASIC-compatible CMOS using copper interconnect," in Proc. IEEE BCTM, 2001, pp. 143-146.
-
Proc. IEEE BCTM, 2001
, pp. 143-146
-
-
Joseph, A.1
Coolbaugh, D.2
Zierak, M.3
Wuthrich, R.4
Geiss, P.5
He, Z.6
Liu, X.7
Orner, B.8
Johnson, J.9
Freeman, G.10
Ahlgren, D.11
Jagannathan, B.12
Lanzerotti, L.13
Ramachandran, V.14
Malinowski, J.15
Chen, H.16
Chu, J.17
Gray, P.18
Johnson, R.19
Dunn, J.20
Subbanna, S.21
Schonenberg, K.22
Harame, D.23
Groves, G.24
Watson, K.25
Jadus, D.26
Meghelli, M.27
Rylyakov, A.28
more..
-
2
-
-
0035167280
-
0.18 μm SiGe BiCMOS technology for wireless and 40 Gb/s communication products
-
K. Schuegraf, M. Racanelli, A. Kalburge, B. Shen, H.Hu. Chun, D. Chapek, D. Howard, D. Quon, D. Feiler, D. Dornisch, G. U'Ren, H. Abdul-Ridha, Z.Zheng Jie, J.Jinshu Zhang, K. Bell, K. Ring, K. Yin, P. Joshi, S. Akhtar, T. Lee, and P. Kempf, "0.18 μm SiGe BiCMOS technology for wireless and 40 Gb/s communication products," in Proc. IEEE BCTM, 2001, pp. 147-150.
-
Proc. IEEE BCTM, 2001
, pp. 147-150
-
-
Schuegraf, K.1
Racanelli, M.2
Kalburge, A.3
Shen, B.4
Chun, H.Hu.5
Chapek, D.6
Howard, D.7
Quon, D.8
Feiler, D.9
Dornisch, D.10
U'Ren, G.11
Abdul-Ridha, H.12
Jie, Z.Z.13
Zhang, J.J.14
Bell, K.15
Ring, K.16
Yin, K.17
Joshi, P.18
Akhtar, S.19
Lee, T.20
Kempf, P.21
more..
-
3
-
-
0035168264
-
A 0.18 μm SiGe:C RF BiCMOS technology for wireless and gigabit optical communication application
-
J. Kirchgessner, S. Bigelow, F. K. Chai, R. Cross, P. Dahl, A. Duvallet, B. Gardner, M. Griswold, D. Hammock, J. Heddleson, S. Hildreth, A. Irudayam, C. Lesher, T. Meixner, P. Meng, M. Menner, J. McGinley, D. Monk, D. Morgan, H. Rueda, C. Small, S. Stewart, M. Ting, I. To, P. Welch, T. Zirkle, and W. M. Huang, "A 0.18 μm SiGe:C RF BiCMOS technology for wireless and gigabit optical communication application," in Proc. IEEE BCTM, 2001, pp. 151-154.
-
Proc. IEEE BCTM, 2001
, pp. 151-154
-
-
Kirchgessner, J.1
Bigelow, S.2
Chai, F.K.3
Cross, R.4
Dahl, P.5
Duvallet, A.6
Gardner, B.7
Griswold, M.8
Hammock, D.9
Heddleson, J.10
Hildreth, S.11
Irudayam, A.12
Lesher, C.13
Meixner, T.14
Meng, P.15
Menner, M.16
McGinley, J.17
Monk, D.18
Morgan, D.19
Rueda, H.20
Small, C.21
Stewart, S.22
Ting, M.23
To, I.24
Welch, P.25
Zirkle, T.26
Huang, W.M.27
more..
-
4
-
-
0034452561
-
COM2 SiGe modular BiCMOS technology for digital, mixed-signal, and RF applications
-
M. Carroll, T. Ivanov, S. Kuehne, J. Chu, C. King, M. Frei, M. Mastrapasqua, R. Johnson, K. Ng, S. Moinian, S. Martin, C. Huang, T. Hsu, D. Nguyen, R. Singh, L. Fritzinger, T. Esry, W. Moller, B. Kane, G. Abeln, D. Hwang, D. Orphee, S. Lytle, M. Roby, D. Vitkavage, D. Chesire, R. Ashton, D. Shuttleworth, M. Thoma, S. Choi, S. Lewellen, P. Mason, T. Lai, H. Hsieh, D. Dennis, E. Harris, S. Thomas, R. Gregor, P. Sana, and W. Wu, "COM2 SiGe modular BiCMOS technology for digital, mixed-signal, and RF applications," IEDM Tech. Dig., pp. 145-148, 2000.
-
(2000)
IEDM Tech. Dig.
, pp. 145-148
-
-
Carroll, M.1
Ivanov, T.2
Kuehne, S.3
Chu, J.4
King, C.5
Frei, M.6
Mastrapasqua, M.7
Johnson, R.8
Ng, K.9
Moinian, S.10
Martin, S.11
Huang, C.12
Hsu, T.13
Nguyen, D.14
Singh, R.15
Fritzinger, L.16
Esry, T.17
Moller, W.18
Kane, B.19
Abeln, G.20
Hwang, D.21
Orphee, D.22
Lytle, S.23
Roby, M.24
Vitkavage, D.25
Chesire, D.26
Ashton, R.27
Shuttleworth, D.28
Thoma, M.29
Choi, S.30
Lewellen, S.31
Mason, P.32
Lai, T.33
Hsieh, H.34
Dennis, D.35
Harris, E.36
Thomas, S.37
Gregor, R.38
Sana, P.39
Wu, W.40
more..
-
5
-
-
0035163916
-
5.3-ps ECL and 71-GHz static frequency divider in self-aligned SEG SiGe HBT
-
E. Ohue, R. Hayami, K. Oda, H. Shimamoto, and K. Washio, "5.3-ps ECL and 71-GHz static frequency divider in self-aligned SEG SiGe HBT," in Proc. IEEE BCTM, 2001, pp. 26-29.
-
Proc. IEEE BCTM, 2001
, pp. 26-29
-
-
Ohue, E.1
Hayami, R.2
Oda, K.3
Shimamoto, H.4
Washio, K.5
-
6
-
-
84907884791
-
Gate polysilicon optimization for deep-submicron MOSFETs
-
J. Schmitz, H. P. Tuinhout, A. H. Montree, Y. V. Ponomarev, P. A. Stolk, and P. H. Woerlee, "Gate polysilicon optimization for deep-submicron MOSFETs," in Proc. ESSDERC, 1999, pp. 156-159.
-
Proc. ESSDERC, 1999
, pp. 156-159
-
-
Schmitz, J.1
Tuinhout, H.P.2
Montree, A.H.3
Ponomarev, Y.V.4
Stolk, P.A.5
Woerlee, P.H.6
-
7
-
-
0005320491
-
Origin and reduction of interfacial boron spikes in silicon molecular beam epitaxy
-
S. S. Iyer, S. L. Delage, and G. J. Scilla, "Origin and reduction of interfacial boron spikes in silicon molecular beam epitaxy," Appl. Phys. Lett., vol. 52, pp. 486-488, 1988.
-
(1988)
Appl. Phys. Lett.
, vol.52
, pp. 486-488
-
-
Iyer, S.S.1
Delage, S.L.2
Scilla, G.J.3
-
8
-
-
0005321782
-
Single-wafer, SiGe heterostructures grown by cold wall UHV-CVD: Application to heterojunction bipolar transistor (HBT) fabrication
-
F. Glowacki, Y. Campidelli, L. Garchery, and A. Gruhle, "Single-wafer, SiGe heterostructures grown by cold wall UHV-CVD: application to heterojunction bipolar transistor (HBT) fabrication," in Proc. ESSDERC, 1994, pp. 745-748.
-
Proc. ESSDERC, 1994
, pp. 745-748
-
-
Glowacki, F.1
Campidelli, Y.2
Garchery, L.3
Gruhle, A.4
-
9
-
-
0005284321
-
Boron spike effect on cut-off frequency and early voltage in SiGe HBTs
-
T. Hashimoto, F. Sato, T. Tatsumi, and T. Tashiro, "Boron spike effect on cut-off frequency and early voltage in SiGe HBTs," in Proc. ESSDERC, 1995, pp. 501-504.
-
Proc. ESSDERC, 1995
, pp. 501-504
-
-
Hashimoto, T.1
Sato, F.2
Tatsumi, T.3
Tashiro, T.4
-
10
-
-
0031146470
-
T of 80 GHz
-
T of 80 GHz," IEICE Trans. Electron., vol. E80-C, pp. 707-713, 1997.
-
(1997)
IEICE Trans. Electron.
, vol.E80-C
, pp. 707-713
-
-
Tashiro, T.1
Hashimoto, T.2
Sato, F.3
Hayashi, Y.4
Tatsumi, T.5
-
11
-
-
0034452569
-
T 0.18 μm RF-SiGe BiCMOS technology considering thermal budget trade-off and with reduced boron-spike effect on HBT characteristics
-
T 0.18 μm RF-SiGe BiCMOS technology considering thermal budget trade-off and with reduced boron-spike effect on HBT characteristics," in IEDM Tech. Dig., 2000, pp. 149-152.
-
(2000)
IEDM Tech. Dig.
, pp. 149-152
-
-
Hashimoto, T.1
Sato, F.2
Aoyama, T.3
Suzuki, H.4
Yoshida, H.5
Fujii, H.6
Yamazaki, T.7
-
12
-
-
0031379775
-
An advanced 0.25-μm BiCMOS process integration technology for multi-GHz communication LSIs
-
Y. Kinoshita, H. Suzuki, S. Nakamura, M. Fukaishi, A. Tajima, Y. Suemura, T. Itani, H. Miyamoto, H. Fujii, M. Yotsuyanagi, N. Henmi, and T. Yamazaki, "An advanced 0.25-μm BiCMOS process integration technology for multi-GHz communication LSIs," in Proc. IEEE BCTM, 1997, pp. 72-75.
-
Proc. IEEE BCTM, 1997
, pp. 72-75
-
-
Kinoshita, Y.1
Suzuki, H.2
Nakamura, S.3
Fukaishi, M.4
Tajima, A.5
Suemura, Y.6
Itani, T.7
Miyamoto, H.8
Fujii, H.9
Yotsuyanagi, M.10
Henmi, N.11
Yamazaki, T.12
-
14
-
-
0030654848
-
2 salicide and shallow trench isolation
-
2 salicide and shallow trench isolation," in Symp. VLSI Tech. Dig. Tech. Papers, 1997, pp. 125-126.
-
Symp. VLSI Tech. Dig. Tech. Papers, 1997
, pp. 125-126
-
-
Kawaguchi, H.1
Abiko, H.2
Inoue, K.3
Saito, Y.4
Yamamoto, T.5
Hayashi, Y.6
Masuoka, S.7
Ono, A.8
Tamura, T.9
Tokunaga, K.10
Yamada, Y.11
Yoshida, K.12
Sakai, I.13
-
18
-
-
0028533164
-
Trench-proximity effects on collector current in self-aligned npn and pnp bipolar transistors
-
P.-F. Lu and J. D. Warnock, "Trench-proximity effects on collector current in self-aligned npn and pnp bipolar transistors," Solid-State Electron., vol. 37, pp. 1871-1875, 1994.
-
(1994)
Solid-State Electron.
, vol.37
, pp. 1871-1875
-
-
Lu, P.-F.1
Warnock, J.D.2
-
20
-
-
6644223175
-
Dedicated pre-clean reduced epi's thermal budget
-
Nov.
-
A. V. Samoilov, D. Du Bois, D. Carlson, and P. B. Comita, "Dedicated pre-clean reduced epi's thermal budget," Semicond. Int., pp. 73-78, Nov. 2000.
-
(2000)
Semicond. Int.
, pp. 73-78
-
-
Samoilov, A.V.1
Du Bois, D.2
Carlson, D.3
Comita, P.B.4
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