Application of decomposed species generated by a heated catalyzer to ULSI fabrication processes

Thin Solid Films

Volumn 430, Issue 1-2, 2003, Pages 265-269

  Izumi, Akira ^a,b   Miki, Tsubasa ^a   Matsumura, Hideki ^a  

^a JAPAN ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY   (Japan)

^b KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Atomic hydrogen; Catalyzer; Photoresist

Indexed keywords

CATALYSIS; DOPING (ADDITIVES); HYDROGEN; ION IMPLANTATION; NITRIDING; PHOTORESISTS; SILICA; SURFACE CHEMISTRY; TUNGSTEN;

HEATED CATALYZERS;

ULSI CIRCUITS;

EID: 0037809488     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00127-5     Document Type: Conference Paper

References (13)

1. Gusev E.P., Lu H.-C., Garfunkel E.L., Gustafsson T., Green M.L. IBM J. Res. Develop. 43:1999;265.
2. Sato S., Homma Y., Sasaki E. J. Vac. Sci. Technol. A. 9:1991;2696.
3. M. Matsumura, Y. Ii, Y. Hayashide, H. Kotani, Proceedings of the VLSI Multilevel Interconnect Conference, 1993, p. 113.
4. Kwon M.S., Lee J.Y. Appl. Surf. Sci. 135:1998;101.
5. Izumi A. Thin Solid Films. 395:2001;260.
6. Izumi A., Masuda A., Matsumura H. Thin Solid Films. 343-344:1999;528.
7. Izumi A., Matsumura H. Appl. Phys. Lett. 71:1997;1371.
8. Izumi A., Sohara S., Kudo M., Matsumura H. Electrochem. Solid State Lett. 2:1999;388.
9. Izumi A., Sato H., Hashioka S., Kudo M., Matsumura H. Microelectronic Eng. 51-52:2000;495.
10. Uchida K., Izumi A., Matsumura H. Thin Solid Films. 395:2001;75.
11. Umemoto H., Ohara K., Morita D., Masuda A., Matsumura H. J. Appl. Phys. 91:2002;1650.
12. Arendt M., White J.M. Appl. Phys. Lett. 64:1994;2116.
13. Hori T. IEEE Trans. Electron. Devices. 37:1990;2058.