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Volumn 51, Issue , 2000, Pages 495-503
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Plasma and fluorocarbon-gas free Si dry etching process using a Cat-CVD system
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Author keywords
[No Author keywords available]
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Indexed keywords
CATALYSIS;
CHEMICAL VAPOR DEPOSITION;
CONTAMINATION;
CRYSTALLINE MATERIALS;
DRY ETCHING;
FLUORINE COMPOUNDS;
HYDROGEN;
SEMICONDUCTOR PLASMAS;
SILICA;
SUBSTRATES;
TUNGSTEN;
X RAY PHOTOELECTRON SPECTROSCOPY;
CRYSTALLINE SILICON;
FLUOROCARBON;
GAS PHASE ETCHING;
SEMICONDUCTING SILICON;
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EID: 0033726819
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/S0167-9317(99)00504-3 Document Type: Article |
Times cited : (41)
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References (17)
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