Ag metallization with high electromigration resistance for ULSI

Solid-State Electronics

Volumn 47, Issue 7 SPEC., 2003, Pages 1227-1231

  Hauder, M ^a   Hansch, W ^a   Gstottner J ^a   Schmitt Landsiedel, D ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

Ag; Electromigration; Etching; Metallization; Patterning

Indexed keywords

ADHESION; CHEMICAL VAPOR DEPOSITION; ELECTRIC RESISTANCE; ELECTROMIGRATION; ETCHING; METALLIZING; SILVER;

ELECTROMIGRATION RESISTANCE;

ULSI CIRCUITS;

EID: 0037741838     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(03)00036-4     Document Type: Conference Paper

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