High-strength and high-fatigue-resistant lead-free solder

Surface mount technology

Volumn 14, Issue 3, 2000, Pages

  Hwang, Jennie S ^a   Guo, Zhenfeng ^a   Koenigsmann, Holger ^a  

^a H Technologies Group Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FATIGUE OF MATERIALS; FRACTURE TOUGHNESS; MELTING; STRAIN; STRENGTH OF MATERIALS; TIN ALLOYS; WETTING;

LEAD-FREE SOLDERS; MELTING TEMPERATURE;

SOLDERED JOINTS;

EID: 0033893378     PISSN: 08933588     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)