Chemical vapor deposition of copper thin films for multi-level interconnections

Microelectronic Engineering

Volumn 66, Issue 1-4, 2003, Pages 415-421

  Cho, Nam Ihn ^a   Nam, H Gin ^a   Choi, Yong ^a   Yang, Jong Soo ^b  

^a SunMoon University   (South Korea)

^b 13F KOTECH Bldg 701 7   (South Korea)

Author keywords

Chemical vapor deposition; Copper thin films; Multi level interconnection processing; Transmission electron microscopy

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; ELECTRIC CONDUCTANCE; INTERCONNECTION NETWORKS; TRANSMISSION ELECTRON MICROSCOPY;

MULTI LEVEL INTERCONNECTION PROCESSING;

THIN FILMS;

EID: 0037393356     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00944-9     Document Type: Conference Paper

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