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Volumn 41, Issue 12, 2002, Pages 7345-7352

A new hydrogen chloride plasma-based copper etching process

Author keywords

Copper; Dry etching of copper; Hydrogen chloride plasma; Plasma etching; Reactive ion etching

Indexed keywords

DRY ETCHING; MICROELECTRONICS; PLASMA ETCHING; POLYCRYSTALLINE MATERIALS; REACTIVE ION ETCHING; SUBSTRATES;

EID: 0036991949     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.7345     Document Type: Article
Times cited : (18)

References (27)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.