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Volumn 41, Issue 12, 2002, Pages 7345-7352
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A new hydrogen chloride plasma-based copper etching process
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Author keywords
Copper; Dry etching of copper; Hydrogen chloride plasma; Plasma etching; Reactive ion etching
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Indexed keywords
DRY ETCHING;
MICROELECTRONICS;
PLASMA ETCHING;
POLYCRYSTALLINE MATERIALS;
REACTIVE ION ETCHING;
SUBSTRATES;
POLYCRYSTALLINE FILMS;
COPPER;
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EID: 0036991949
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.41.7345 Document Type: Article |
Times cited : (18)
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References (27)
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