Investigation of carrying agents on microstructure of electroplated Cu films

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 11, 2002, Pages 6347-6350

  Shieh, Jia Min ^a   Chang, Shih Chieh ^b   Dai, Bau Tong ^a   Feng, Ming Shiann ^b  

^a NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^b NONE

Author keywords

Cu; Electroplating; Inhibition; Polyethylene glycol; Resistivity

Indexed keywords

COPPER PLATING; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; CURRENT DENSITY; ELECTROLYTES; ELECTROPLATING; GRAIN GROWTH; GRAIN SIZE AND SHAPE; MOLECULAR WEIGHT; POLYETHYLENE GLYCOLS;

CARRYING AGENTS;

METALLIC FILMS;

EID: 0036873152     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.6347     Document Type: Article

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