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Volumn 149, Issue 8, 2002, Pages
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Recovering dielectric loss of low dielectric constant organic siloxane during the photoresist removal process
a,c b c b b d b,c |
Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL BONDS;
CURRENT VOLTAGE CHARACTERISTICS;
DIELECTRIC LOSSES;
FOURIER TRANSFORM INFRARED SPECTROSCOPY;
INTEGRATED CIRCUIT MANUFACTURE;
LEAKAGE CURRENTS;
MOISTURE;
OXYGEN;
PERMITTIVITY;
PHOTORESISTS;
PLASMAS;
HEXAMETHYLDISILAZANE;
HYBRID ORGANIC SILOXANE POLYMER;
LOW DIELECTRIC CONSTANT ORGANIC SILOXANE;
OXYGEN PLASMA ASHING;
PHOTORESIST REMOVAL PROCESS;
SILICONES;
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EID: 0036686548
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1485776 Document Type: Article |
Times cited : (46)
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References (12)
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