Diamondlike carbon materials as low-k dielectrics for multilevel interconnects in ULSI

Materials Research Society Symposium - Proceedings

Volumn 443, Issue , 1997, Pages 155-164

  Grill, A ^a   Patel, V ^a   Saenger, K L ^a   Jahnes, C ^a   Cohen, S A ^a   Schrott, A G ^a   Edelstein, D C ^a   Paraszczak, J R ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; DIELECTRIC FILMS; FLUORINE; HYDROGENATION; PERMITTIVITY; REACTIVE ION ETCHING; RESIDUAL STRESSES; SILICON; THERMODYNAMIC STABILITY; ULSI CIRCUITS;

INTERLEVEL DIELECTRICS; INTRALEVEL DIELECTRICS; MULTILEVEL INTERCONNECTIONS;

DIAMOND FILMS;

EID: 0030700981     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)