Dry cleaning technology of silicon wafer with a line beam for semiconductor fabrication by KrF excimer laser

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 7 A, 2002, Pages 4563-4570

  Kim, Dae Jin ^a   Kim, Yong Kee ^a   Ryu, Je Kil ^a   Kim, Hyun Jung ^a  

^a Hantech Co Ltd Korea   (South Korea)

Author keywords

Ablation; KrF excimer laser; Laser cleaning; Particle removal; Photoresist strip

Indexed keywords

ATOMIC FORCE MICROSCOPY; CRYSTALLIZATION; EXCIMER LASERS; HIGH ENERGY LASERS; LASER BEAM EFFECTS; MORPHOLOGY; PHOTORESISTS; REMOVAL; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACES; VLSI CIRCUITS;

LASER CLEANING; PARTICLE REMOVAL; PHOTORESIST STRIP;

SILICON WAFERS;

EID: 0036655952     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.4563     Document Type: Article

References (20)