Laser, dry and plasmaless, photoresist removal

Solid State Technology

Volumn 40, Issue 7, 1997, Pages 197-202

  Livshits, Boris ^a,b,c,d   Tehar Zahav, Ofer ^a,b,e,f,g   Iskevitch, Eli ^a,b,f,h   Genut, Menachem ^a,f,i,j,k  

^a Oramir Semiconductor Equipment Ltd   (Israel)

^b Oramir ^*  (Israel)

^c RUSSIAN ACADEMY OF SCIENCES   (Russian Federation)

^d NEW YORK ACADEMY OF SCIENCES   (United States)

^e HEBREW UNIVERSITY OF JERUSALEM   (Israel)

^f TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^g INTEL CORPORATION   (United States)

^h R and D   (Israel)

ⁱ Optical Technology and Networking Group Israel   (Israel)

^j CARNEGIE MELLON UNIVERSITY   (United States)

^k WEIZMANN INSTITUTE OF SCIENCE   (Israel)

more..

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS; EXCIMER LASERS; PHOTORESISTS; POLYCRYSTALLINE MATERIALS; REACTIVE ION ETCHING; STRIPPING (REMOVAL);

HIGH-DOSE IMPLANTATION (HDI);

SILICON WAFERS;

EID: 0031173549     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (16)

1. D.L. Flamm, "Dry Plasma Resist Stripping, Part I," Solid State Technology, pp. 37-39, August 1992.
2. D.L. Flamm, "Dry Plasma Resist Stripping, Part II," Solid State Technology, pp. 43-48, September 1992.
3. D.L. Flamm, "Dry Plasma Resist Stripping, Part III," Solid Stete Technology, pp. 43-48, October 1992.
4. D.A. Toy, "Choose the Right Process to Strip Your Photoresist," Semiconductor International, pp. 82-87, February 1990.
5. P. Burggraaf, "Resist Implant Problems: Some Solved, Others Not," Semiconductor International, pp. 66-69, June 1992.
6. S. Fujimura, J. Konno, K. Hikazutani, H. Yano, "Ashing of Ion Implanted Resist Layer," Japanese Journal of Applied Physics, Vol. 28, No. 10, pp. 2130-2136, 1989.
7. P. Burggraaf, "What's Driving Resist Dry Stripping?" Semconductor International, pp. 61-64, November 1994.
8. P. Singer, "Plasma Ashing Moves into the Mainstream, "Semiconductor International, pp. 83-88, August 1996.
9. R. Srinivasan, B. Braren, "Ultraviolet Laser Ablation of Organic Polymers," Chemcal Reviews, Vol. 89, pp. 1303-1316, 1989.
10. D.E. Seeger, M.G. Rosenfeld, "Clearing Resist from Alignment Mark Areas Using an Excimer Laser," J. Vac. Sci. Technol., Vol. B6, No. 1, pp. 399-402, 1988.
11. O. Teher-Zahav, "Photoresist Stripping by Excimer-laser Ablation," MSc Thesis, Hebrew University of Jerusalem, Israel, 1992.
12. O. Tehar-Zahav, "Photoresist Stripping by Excimer-laser Ablation. "MSc Thesis, Hebrew University of Jerusalem, Israel, 1992.
13. B. Livshits, "Laser Stripping Problems Solution, "Oramir Semiconductor Equipment Ltd., Hafa, Israel, unpublished, 1993.
14. M. Genut, O. Teher-Zahav, E. Iskevitch, B. Livshits, "Excimer Laser Photoersist Stripping," Advances in Persist Technology and Processing XIII, Vol. 2724, pp. 601-612, SPIE, 1996.
15. T. Francis, "Controlling Process Equipment Contamination in the 90s," Semiconductor International, pp. 62-66, October 1993.
16. T. Francis, "Not by Particle Count Alone: Getting to the Root Cause of Contamination," Micro, pp. 69-78, July/August 1996.