Three-dimensional visualization of multilayered assemblies using X-ray laminography

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 3, 1997, Pages 361-366

  Kalukin, Andrew R ^a   Sankaran, Vijay ^a,b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b IEEE   (United States)

Author keywords

3 D visualization; Artifacts; Image reconstruction; Imaging; Inspection; Laminography; Metrology; Microelectronics; Solder joints; X rays

Indexed keywords

IMAGE RECONSTRUCTION; IMAGING TECHNIQUES; INSPECTION; MICROELECTRONIC PROCESSING; SOLDERED JOINTS; VISUALIZATION; X RAYS;

MULTILAYERED ASSEMBLIES; X RAY LAMINOGRAPHY;

ELECTRONICS PACKAGING;

EID: 0031237618     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.623031     Document Type: Article

References (6)

1. T. A. Siewert and M. W. Austin, "The contributions of out-of-plane material to a scanned-beam laminography image," Mater. Evaluation, pp. 1194-1198, Oct. 1994.
2. A. R. Kalukin, V. Sankaran, B. Chartrand, D. L. Millard, R. P. Kraft, and M. J. Embrechts, "An improved method for inspection of solder joints using X-ray laminography and X-ray microtomography," in Proc. 1996 IEEE/CPMT Int. Electron. Manufact. Technol. Symp., Oct. 14-16, 1996, pp. 438-445.
3. S. M. Rooks, B. Benhabib, and K. C. Smith, "Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 18, pp. 851-861, Dec. 1995.
4. G. T. Herman, Image Reconstruction from Projections. New York: Academic Press, 1980.
5. A. C. Kak and M. Slaney, Principles of Computerized Tomographic Imaging. New York: IEEE, 1988.
6. B. Chartrand, "Development of a cross-platform inspection machine control interface for inspection of electronic assemblies," M.S. thesis, Rensselaer Polytechnic Inst., Troy, NY, 1996.