Detection of underfill epoxy defects in flip chip packages with the aid of SAM, parallel polishing & FIB

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 1999, Pages 50-54

  Tang, T N ^a   Heng, H C ^a   Chau, S Y ^a   Hiew, Marshall ^a  

^a Device Analysis Lab   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; CRYSTAL DEFECTS; ELECTRONICS PACKAGING; ION BEAMS; POLISHING;

SCANNING ACOUSTIC MICROSCOPY (SAM);

FLIP CHIP DEVICES;

EID: 0033283942     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ipfa.1999.791303     Document Type: Conference Paper

References (6)