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Volumn 410, Issue 1-2, 2002, Pages 121-128
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Improvement of Ta-based thin film barriers on copper by ion implantation of nitrogen and oxygen
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Author keywords
Diffusion barrier; Ion implantation; Metallization; Tantalum
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Indexed keywords
ANNEALING;
AUGER ELECTRON SPECTROSCOPY;
COPPER;
CRYSTAL MICROSTRUCTURE;
CRYSTALLIZATION;
INTERFACES (MATERIALS);
ION BOMBARDMENT;
ION IMPLANTATION;
MAGNETRON SPUTTERING;
NANOSTRUCTURED MATERIALS;
NITROGEN;
OXYGEN;
POLYCRYSTALLINE MATERIALS;
SPUTTER DEPOSITION;
TANTALUM;
THERMODYNAMIC STABILITY;
EPITAXIAL FILMS;
THIN FILMS;
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EID: 0036574150
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/S0040-6090(02)00273-0 Document Type: Article |
Times cited : (8)
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References (18)
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