SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 373, Issue 1-2, 2000, Pages 64-67

Chemical stability of Ta diffusion barrier between Cu and Si

(5) Laurila, T a Zeng, K a Kivilahti, J K a Molarius, J b Suni, I b

a AALTO UNIVERSITY (Finland)

b VTT TECHNICAL RESEARCH CENTRE OF FINLAND (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION IN SOLIDS; METALLIZING; MICROSTRUCTURE; PHASE DIAGRAMS; REACTION KINETICS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SILICON; SPUTTERING; TANTALUM; THIN FILMS;

CHEMICAL STABILITY;

METALLIC FILMS;

EID: 0034262690 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(00)01102-0 Document Type: Article

Times cited : (47)

References (18)

1
- 0020543433
- Weber E. Appl. Phys. A1:1983;1.
- (1983) Appl. Phys. , vol.1 , pp. 1
- Weber, E.¹

2
- 0346923885
- Broniatowski A. Phys. Rev. Lett. 62:1989;3074.
- (1989) Phys. Rev. Lett. , vol.62 , pp. 3074
- Broniatowski, A.¹

3
- 0029633279
- Torres J. Appl. Surf. Sci. 91:1995;112.
- (1995) Appl. Surf. Sci. , vol.91 , pp. 112
- Torres, J.¹

4
- 0031272515
- Murarka S.P. Microelectron. Eng. 37/38:1997;29.
- (1997) Microelectron. Eng. , vol.3738 , pp. 29
- Murarka, S.P.¹

5
- 0343407322
- ASM
- Metals Handbook, vol. 1, Properties and Selection of Materials, 8 ed., ASM (1960).
- (1960) Metals Handbook, Vol. 1, Properties and Selection of Materials, 8 Ed.

6
- 0343407331
- Kwon K.-W., Lee H.-J., Sinclair R. Appl. Phys. Lett. 75:1999;7.
- (1999) Appl. Phys. Lett. , vol.75 , pp. 7
- Kwon, K.-W.¹ Lee, H.-J.² Sinclair, R.³

7
- 0022078317
- Ottaviani G. Thin Solid Films. 140:1985;3.
- (1985) Thin Solid Films , vol.140 , pp. 3
- Ottaviani, G.¹

8
- 85031555873
- Ichikawa T., Takeyama M., Noya A. Jpn. J. Appl. Phys. 35:1996;3.
- (1996) Jpn. J. Appl. Phys. , vol.35 , pp. 3
- Ichikawa, T.¹ Takeyama, M.² Noya, A.³

9
- 0343407330
- Holloway K., Fryer P. Appl. Phys. Lett. 57:1990;17.
- (1990) Appl. Phys. Lett. , vol.57 , pp. 17
- Holloway, K.¹ Fryer, P.²

10
- 0343843313
- Holloway K., Fryer P., Cabral C., arper J., Bailey P., Kelleher K. J. Appl. Phys. 71:1992;11.
- (1992) J. Appl. Phys. , vol.71 , pp. 11
- Holloway, K.¹ Fryer, P.² Cabral, C.³ Arper, J.⁴ Bailey, P.⁵ Kelleher, K.⁶

11
- 0027909238
- Olowolafe J., Mogab C., Gregory R. Thin Solid Films. 227:1993;37.
- (1993) Thin Solid Films , vol.227 , pp. 37
- Olowolafe, J.¹ Mogab, C.² Gregory, R.³

12
- 0343843312
- Kang B.-S., Lee S.-M., Kwak J., Yoon D.-S., Baik H-K. J. Electrochem. Soc. 144:1997;5.
- (1997) J. Electrochem. Soc. , vol.144 , pp. 5
- Kang, B.-S.¹ Lee, S.-M.² Kwak, J.³ Yoon, D.-S.⁴ Baik, H.-K.⁵

13
- 0002778029
- Stavrev M., Fischer D., Preuss A., Wentzel C., Mattern N. Microelectron. Eng. 33:1997;269.
- (1997) Microelectron. Eng. , vol.33 , pp. 269
- Stavrev, M.¹ Fischer, D.² Preuss, A.³ Wentzel, C.⁴ Mattern, N.⁵

14
- 0000792302
- Yoon D.-S., Baik H.-K., Lee S.-M. J. Appl. Phys. 83(3):1998;1333.
- (1998) J. Appl. Phys. , vol.83 , Issue.3 , pp. 1333
- Yoon, D.-S.¹ Baik, H.-K.² Lee, S.-M.³

15
- 0032755314
- Seibt M., Hedemann H., Istratov A., Riedel F., Sattler A., Schröter W. Phys. Stat. Sol. A. 171:1999;301.
- (1999) Phys. Stat. Sol. a , vol.171 , pp. 301
- Seibt, M.¹ Hedemann, H.² Istratov, A.³ Riedel, F.⁴ Sattler, A.⁵ Schröter, W.⁶

16
- 0022897506
- Johnson W.L. Phys. Rev. Lett. 30:1986;81.
- (1986) Phys. Rev. Lett. , vol.30 , pp. 81
- Johnson, W.L.¹

17
- 0342537780
- R.F. sputtered Ta-based diffusion barriers between Cu and Si
- in press
- J. Molarius, I. Suni, T. Laurila, K. Zeng, J.K. Kivilahti, R.F. sputtered Ta-based diffusion barriers between Cu and Si, Thin Solid Films (2000) in press.
- (2000) Thin Solid Films
- Molarius, J.¹ Suni, I.² Laurila, T.³ Zeng, K.⁴ Kivilahti, J.K.⁵

18
- 0003659399
- J.M. Poate, K.N. Tu, & J.W. Mayer. New York: Wiley
- Tu K.N. Poate J.M., Tu K.N., Mayer J.W. Thin Film Interdiffusion and Reactions. 1978;360-403 Wiley, New York.
- (1978) Thin Film Interdiffusion and Reactions , pp. 360-403
- Tu, K.N.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.