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Volumn 5, Issue 2-3, 2002, Pages 301-304
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Anisotropic deposition of copper by H-assisted plasma chemical vapor deposition
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Author keywords
Anisotropic chemical vapor deposition; Cu; H; Interconnect; Plasma CVD; ULSI
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Indexed keywords
ANISOTROPY;
ION BOMBARDMENT;
METALLIZING;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
ULSI CIRCUITS;
ANISOTROPIC DEPOSITION;
INTEGRATED CIRCUIT INTERCONNECTS;
COPPER;
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EID: 0036557720
PISSN: 13698001
EISSN: None
Source Type: Journal
DOI: 10.1016/S1369-8001(02)00108-7 Document Type: Conference Paper |
Times cited : (10)
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References (12)
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