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Advanced Metallization Conference (AMC)

Volumn , Issue , 2000, Pages 271-278

H assisted control of quality and conformality in Cu film deposition using plasma CVD method

(6) Shiratani, Masaharu a Jin, Hong Jie a Takenaka, Kosuke a Koga, Kazunori a Kinoshita, Toshio a Watanabe, Yukio a

a KYUSHU UNIVERSITY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; GRAIN SIZE AND SHAPE; HYDROGEN; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; QUALITY CONTROL; SURFACE ROUGHNESS;

FILM DEPOSITION;

METALLIC FILMS;

EID: 0034460825 PISSN: 10480854 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (2)

References (12)

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7
- 0000832038
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8
- 0034431007
- Materials, technology and reliability for advanced interconnects and low-k dielectrics
- edited by K. Maex, Y-C. Joo, G.S. Oehrlein, S. Ogawa, J.T. Wetzel (Pittsburgh, PA)
- (2000) Mater. Res. Soc. Proc. , vol.612
- Shiratani, M.¹ Jin, H.J.² Nakatake, Y.³ Koga, K.⁴ Kinoshita, T.⁵ Watanabe, Y.⁶

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