Wafer level batch transfer process of RF MEMS passive device using PDMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 169-174

  Park, Sang Won ^a   Kim, Kabseog ^a   Davis, Wendell Alan ^b   Lee, Jeong Bong ^a  

^a The University of Texas at Dallas   (United States)

^b UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

Author keywords

Electroplating; PDMS; Planarization; Wafer level batch transfer

Indexed keywords

ELECTRONICS PACKAGING; ELECTROPLATING; FLUIDICS; ORGANIC POLYMERS; PHOTORESISTS; SUBSTRATES;

BENZOCYCLOBUTENE; PASSIVE DEVICE; PLANARIZATION; PLASTIC REPLICATION TECHNIQUE; POLYDIMETHYLSILOXANE; WAFER LEVEL BATCH TRANSFER PROCESS;

MICROELECTROMECHANICAL DEVICES;

EID: 0036448517     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

1. R. T. Howe, "Polysilicon Integrated Microsystems: Technologies and application", Transducers 1995, Digest of Technical Papers, pp.43-46, 1995.
2. M.-A. Grétillat, P. Thiébaud, C. Linder, and N. F. D. Rooji, "Integrated Circuit Compatible Electrostatic Polysilison Microrelays", Journal of Micromechanics and Microengineering., Vol. 5, No. 2, 156-160, June, 1995.
3. K. A. Shaw and N. C. MacDonald, "Integrating SCREAM Micromachined Devices with Integrated Circuits", Proceedings of the IEEE 1996 Micro Electro Mechanical Systems Workshop, San Diego, CA, pp. 44-48, 1996.
4. A. Singh, D. A. Horsley, M. B. Cohn, A. P. Pisano, and R. T. Howe, "Batch Transfer of Microstructures using Flip-Chip Solder Bonding", Journal of Microelectromechanical Systems, Vol. 8, No. 1, pp.27-33, March, 1999.
5. K. W. Oh and C. H. Ahn, "Development of an Innovative Flip-Chip Bonding Technique using Micromachined Conductive Polymer Bumps", Proceedings of the 1998 Solid-State Sensor and Actuator Workshop, Hiton Head Island, SC, pp. 170-173, 1998.
6. J. J. Yao and M. F. Chang, "Surface-Micromachined Miniature switch for telecommunications applications with signal frequencies from DC up to 4 GHz" Technical Digest, 8th International Conference on Solid-State Sensors and Actuators, pp. 384-387, 1995.
7. J. J. Yao, S. Park, and J. DeNatale, "High Tuning-Ratio MEMS-based tunable capacitors for RF Communications Applications", Technical Digest, Solid-State Sensor and Actuator Workshop, pp. 124-127, 1998.
8. J.-B. Yoon, C.H. Han, E. Yoon, and C.-K. Kim, "High-Performance Three-Dimensional On-Chip Inductors Fabricated by Novel Micromachining Technology for RF MMIC", Technical Digest, IEEE MTT-S International Microwave Symposium, pp. 1523-1526, 1999.
9. N. Chomnawang and J.-B. Lee, "On-Chip 3D Air Core Micro-Inductor for High-Frequency Applications using Deformation of Sacrificial Polymer", Proceedings of the SPIE: Smart Electronics and Materials 2001, Newport Beach, CA, Mar. 4-8, pp. 54-62, 2001.
10. K. F. Harsh, W. Zhang, V. M. Bright and Y.C.Lee, "Flip-Chip Assembly for Si-based RF MEMS", 12th IEEE Int. Conf. MEMS, pp273-278, 1999.
11. D. C. Duffy, O.J.A. Schueller, S.T. Brittain, and G. M. Whitesides, "Rapid Prototyping of microfluidic Switches in Polydimethylsiloxane and Their Actuation by Electro-Osmotic Flow", Journal of Micromechanics and Microengineering, Vol. 9, No. 3, pp. 211-217, September, 1999.
12. B. H. Jo, L. M. V. Lerbeghe, K. M. Motsegood, and D. J. Beebe, "Three-dimensional Micro-Channel Fabrication in Polydimethylsiloxane (PDMS) elastomer", Journal of Microelectromechanical Systems, Vol. 9, No. 1, pp. 76-81, March, 2000.
13. K. Hosokawa and R. Maeda, "A Pneumatically-Actuated Three-way Microvalve Fabricated with Technique", Journal of Micromechanics and Microengineering, Vol. 10, No. 3, pp. 415-420, September, 2000.
14. Y. Xia and G. M. Whitesides, "Soft Lithography", Angewabdte Chemie International Edition, Vol. 37, pp.550-575, March, 1998.
15. S. W. Park, K. Kim, H. Manohara, and J.-B. Lee. "Massive Replication of Polymeric High Aspect Ratio Microstructures using PDMS Casting", Proceedings of the SPIE: Smart Electronics and Materials 2001, Newport Beach, CA, Mar. 4 - 8, pp.271-279, 2001.
16. J.-B. Lee, J. English, C.-H. Ahn, and M. G. Allen, "Planarization Techniques for Vertically Integrated Metallic MEMS on Silicon Foundry Chips", Journal of Micromechanics and Microengineering, Vol. 7, No. 2, pp. 44-54, June, 1997.