Reaction kinetics of Pb-Sn and Sn-Ag solder balls with electroless Ni-P/Cu pad during reflow soldering in microelectronic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1650-1657

  Alam, M O ^a   Chan, Y C ^a   Hung, K C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTRONIC PACKAGING; REFLOW SOLDERING;

BINARY ALLOYS; DIFFUSION; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); INTERMETALLICS; MICROELECTRONIC PROCESSING; REACTION KINETICS; SOLDERING; TERNARY SYSTEMS; X RAY DIFFRACTION ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0036292863     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008329     Document Type: Conference Paper

References (30)

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22. Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology
23. Reliability study of the electroless Ni-P layer against solder