Investigation of the adhesion strength between molding compound and leadframe at higher temperatures

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 349-353

  Schmidt, R ^a   Alpern, P ^a   Plecher, K ^a   Tilgner, R ^a  

^a SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; PLASTICS MOLDING; STRENGTH OF MATERIALS; THERMAL EFFECTS;

LEAD FRAMES; POPCORN EFFECTS;

ELECTRONICS PACKAGING;

EID: 0032230764     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)