Hygrothermal reliability evaluation of plastic IC packages with computer-aided engineering tools

IEEE International Symposium on Polymeric Electronics Packaging, PEP

Volumn , Issue , 1997, Pages 158-168

  Kuo, An Yu ^a   Nguyen, Luu T ^a  

^a Optimal Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER AIDED SOFTWARE ENGINEERING; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; PLASTIC PRODUCTS; RELIABILITY;

HYGROTHERMAL RELIABILITY EVALUATIONS;

ELECTRONICS PACKAGING;

EID: 0031346615     PISSN: 14029855     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)