Investigations on popcorn cracking of T-QFP packages

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 944-951

  Dudek, R ^a   Sommer, P ^a   Michel, B ^a   Alpern, P ^b   Birzer, C ^b   Tilgner, R ^b  

^a FRAUNHOFER IZM   (Germany)

^b SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE MECHANICS; FRACTURE TOUGHNESS; HYDROSTATIC PRESSURE; NETWORK COMPONENTS; CRACK INITIATION; DELAMINATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); PLASTIC MOLDS; STIFFNESS; STRESS ANALYSIS; THERMAL EFFECTS;

ELASTIC STIFFNESS; EXPERIMENTAL INVESTIGATIONS; FE ANALYSIS; LINEAR ELASTIC FRACTURE MECHANICS; LOW STRESS; PACKAGE DESIGNS; PRESSURE-INDUCED STRESS; QUAD FLAT PACKS;

CRACKS; ELECTRONICS PACKAGING;

POPCORN CRACKING; THIN QUAD FLAT PACK (TQFP) PACKAGES;

EID: 0031629059     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678822     Document Type: Conference Paper

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