Step forward in the transient thermal characterization of chips and packages

Microelectronics Reliability

Volumn 39, Issue 1, 1999, Pages 89-96

  Szekely V ^a   Rencz, M ^b   Courtois, B ^c  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^b MicReD Ltd   (Hungary)

^c TIMA LABORATORY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; PROBLEM SOLVING; THERMOANALYSIS;

THERMAL COUPLING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 18244428739     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00198-X     Document Type: Article

References (11)

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