Reliability of microBGA assembly using no-flow underfill

Microelectronics Reliability

Volumn 41, Issue 12, 2001, Pages 1993-2000

  Tu, P L ^a   Chan, Y C ^a   Hung, K C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); FATIGUE OF MATERIALS; MAGNETIC FLUX; SCANNING ELECTRON MICROSCOPY; SHOCK TESTING; THERMAL EXPANSION; WEIBULL DISTRIBUTION;

UNDERFILL TECHNOLOGY;

FLIP CHIP DEVICES;

EID: 0035576342     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00115-9     Document Type: Article

References (23)

1. Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications
2. Eutectic solder flip chip technology - Bumping and assembly process development for CSP/BGA
3. Reworkable underfills for flip chip, BGA, and CSP applications
4. Reliability evaluation of chip-on-flex CSP devices
5. Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle
6. High throughput flip chip processing and reliability analysis using no-flow underfills
7. Evaluation of pre-deposited (no-flow) underfill for low-cost flip chip assembly
8. Compression flow modeling of underfill encapsulants for low cost flip chip assembly packaging
9. Initial development work on high throughput low cost FC on board assembly process
10. Characterization of a no-flow underfill encapsulant during the solder reflow process
11. High performance no-flow underfills for low-cost flip-chip applications: Material characterization
12. Recent advances in the development of no-flow underfill encapsulants - A practical approach towards the actual manufacturing application
13. Correlation of flip chip underfill process parameters and material properties with in-process stress generation
14. Study of the self-alignment of no-flow underfill for microBGA assembly
15. Study of microBGA solder joint reliability
16. Comparative study of microBGA reliability under bending stress
17. Evaluation of reliability of μBGA solder joints through twisting and bending
18. Advanced CSP and substrate technologies
19. Finite element analysis for solder ball failure in chip scale package
20. Vibration fatigue of μBGA solder joint