Finite element analysis for solder ball failures in chip scale package

Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 1997, Pages 39-43

  Lee, Taekoo ^a   Lee, Jinhyuk ^a   Jung, Ilgyu ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; SEMICONDUCTOR DEVICE MODELS; SHEAR STRESS; SOLDERED JOINTS;

CHIP SCALE PACKAGES (CSP);

SEMICONDUCTOR DEVICE TESTING;

EID: 0031339023     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)