Complete methodology for electrical modeling of RFIC packages

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 542-547

  Horng, Tzyy Sheng ^a,b   Wu, Sung Mao ^b   Shih, Charlie ^c  

^a IEEE   (Taiwan)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^c Silicon Integrated Systems group   (Taiwan)

Author keywords

Electrical model; RFIC packages; S parameter measurement; Think shrink small outline packages

Indexed keywords

ELECTRICAL MODELLING; RADIO-FREQUENCY INTEGRATED CIRCUIT PACKAGE; THIN SHRINK SMALL OUTLINE PACKAGE; VECTOR NETWORK ANALYZER;

COMPUTER SIMULATION; ELECTRIC NETWORK ANALYZERS; EQUIVALENT CIRCUITS; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; MICROSTRIP LINES; MICROWAVE INTEGRATED CIRCUITS; OPTIMIZATION; PRINTED CIRCUIT BOARDS; SCATTERING PARAMETERS; SURFACE MOUNT TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 0035521097     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982842     Document Type: Article

References (10)

1. Frequency limitation on an assembled SOP8 package
2. Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems
3. Capacitance calculation of IC packages using the finite element method and plane of symmetry
4. A computer program that generates an RF electrical model of the parasitics of QFP packages
5. Package inductance measurement at high frequencies
6. Measurement and field simulation based characterization of plastic packages
7. Surface mount microwave package characterization technique
8. Electrical modeling of RFIC packages up to 12 GHz
9. Advanced measurement techniques for generation of SPICE models of RFIC packages
10. Accurate measurement of ground-ring inductance in ball grid array package