Package inductance measurement at high frequencies

Proceedings - Electronic Components Conference

Volumn , Issue , 1992, Pages 740-744

  Tsai, Chi Taou ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC IMPEDANCE MEASUREMENT; ELECTRIC VARIABLES MEASUREMENT; EMITTER COUPLED LOGIC CIRCUITS; INTEGRATED CIRCUITS;

ECL CHIPS; PACKAGE INDUCTANCE MEASUREMENT; TAB (TAPE AUTOMATED BONDING);

ELECTRONICS PACKAGING;

EID: 0026718065     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)