Measurement and field simulation based characterization of plastic IC packages

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1997, Pages 181-184

  Mernyei, Ferenc ^a  

^a Austria Mikro Systeme Int AG   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC NETWORK ANALYZERS; EQUIVALENT CIRCUITS; INTEGRATED CIRCUIT LAYOUT;

DEVICE UNDER TEST (DUT);

ELECTRONICS PACKAGING;

EID: 0031341768     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)