Electrical modeling of RFIC packages up to 12 GHz

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 867-872

  Horng, T S ^a   Wu, S M ^a   Shih, C ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC LOSSES; ELECTRIC NETWORK ANALYZERS; ELECTRIC PROPERTIES; EQUIVALENT CIRCUITS; IMPEDANCE MATCHING (ELECTRIC); INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; MATHEMATICAL MODELS;

BROADBAND VECTOR NETWORK ANALYZER; COUPLED TRACES MEASUREMENT; RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGES; TWO PORT SCATTERING PARAMETERS;

ELECTRONICS PACKAGING;

EID: 0032673299     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)