Accurate measurement of ground-ring inductance in ball grid array package

Electronics Letters

Volumn 35, Issue 7, 1999, Pages 520-521

  Horng, Tzyy Sheng ^a   Wu, Sung Mao ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; ELECTRIC CONNECTORS; ELECTRIC NETWORK ANALYZERS; INDUCTANCE MEASUREMENT;

BALL GRID ARRAY (BGA) PACKAGES; GROUND-RING INDUCTANCE MEASUREMENT; SOFTWARE PACKAGE ANSOFT;

ELECTRONICS PACKAGING;

EID: 0032643083     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19990408     Document Type: Article

References (5)

1. HIRANO, N., MIURA, M., and SUDO, T.: 'Characterization and reduction of simultaneous switching noise for multilayer packages', Proc. 44th ECTC, 1994, pp. 949-956
2. SENTHINATHAN, R., CANGELLARIS, A.C., and PRINCE, J.L.: 'Reference plane parasitics modeling and their contribution to the power and ground path effective inductance as seen by the output drivers', IEEE Trans., 1994, MTT-42, (9), pp. 1765-1773
3. CHOU, T.Y., and PATIL, S.: 'Power and ground plane modeling and simultaneous switching noise simulation for multilayer packages', Int. J. Microcircuits Electron. Packag., 1995, 18, pp. 92-101
4. KATO, K., MIURA, M., ITO, K., YAMAJI, Y., and SUDO, T.: 'New electrical modeling approach for simultaneous switching noise for high-performance packages', Proc. 46th ECTC, 1996, pp. 739-746
5. FRASER, A.D., BELL, O.C., and STROUTH, C.T.: 'Electrical characterization of ball grid array (BGA) packages', Technical report, GigaTest Labs, 1996