Advanced measurement techniques for generation of SPICE models of RFIC packages

Electronics Letters

Volumn 35, Issue 22, 1999, Pages 1945-1946

  Horng, Tzyy Sheng ^a   Wu, Sung Mao ^a   Shih, C ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; CAPACITANCE; COMPUTER SIMULATION; ELECTRIC NETWORK ANALYZERS; EQUIVALENT CIRCUITS; INTEGRATED CIRCUITS; NATURAL FREQUENCIES; OPTIMIZATION; SCATTERING PARAMETERS;

RADIOFREQUENCY INTEGRATED CIRCUITS; VECTOR NETWORK ANALYZER MEASUREMENT TECHNIQUE;

ELECTRONICS PACKAGING;

EID: 0033313807     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19991338     Document Type: Article

References (5)

1. NDAGIJIMANA, F., et al..: 'Frequency limitation on an assembled SOP8 package'. Proc. 43rd ECTC, 1993, pp. 530-535
2. CAGGIANO, M.: 'A computer program that generates an RF electrical model of the parasitics of QFP packages'. Proc. 47th ECTC, 1997, pp. 1146-1151
3. TSAI, C.T.: 'Package inductance measurement at high frequencies'. Proc. 42nd ECTC, 1992, pp. 740-744
4. MERNYEI, F.: 'Measurement and field simulation based characterization of plastic packages'. Proc. 6th Topical Meeting Elect. Perf. Electron. Packag., 1997, pp. 181-184
5. HUANG, C.C., WONG, F., and KIM, D.: 'Electrical performance of PBGA as compared to MQFP in high frequency applications'. Proc. IEPS, 1995, pp. 417-428