Mask aligners in advanced packaging

Solid State Technology

Volumn 41, Issue 3, 1998, Pages

  Toennies, Dietrich ^a   Toepper, Michael ^a   Wolf, Juergen ^a   Engelmann, Gunter ^a   Reichl, Herbert ^a  

^a Karl Suess KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; INTEGRATED CIRCUIT MANUFACTURE; MASKS; PHOTOLITHOGRAPHY; SCREEN PRINTING; SOLDERING; VAPOR DEPOSITION;

MASK ALIGNERS; PHYSICAL VAPOR DEPOSITION; SOLDER BUMPS; TAPE AUTOMATED BONDING (TAB);

ELECTRONICS PACKAGING;

EID: 0032010591     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)