Thermal behaviour analysis of an MCM-D technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3830, Issue , 1999, Pages 301-304

  Cabruja, E ^a   Lozano, M ^a   Santander, J ^a   Collado, A ^a   Ullan, M ^a   Lora Tamayo, E ^a  

^a UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CMOS INTEGRATED CIRCUITS; ELECTRIC CONTACTS; ELECTRIC RESISTANCE MEASUREMENT; FLIP CHIP DEVICES; MULTICHIP MODULES; RESISTORS; SCREEN PRINTING; SEMICONDUCTING SILICON; SUBSTRATES; TEMPERATURE; THERMOANALYSIS;

CONTACT RESISTANCE; KELVIN CONTACTS; SHEET RESISTANCE; VAN DER PAUW STRUCTURES;

ELECTRONICS PACKAGING;

EID: 0033363605     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)