Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs

IEEE Transactions on Microwave Theory and Techniques

Volumn 49, Issue 9, 2001, Pages 1538-1545

  Horng, Tzyy Sheng ^a   Wu, Sung Mao ^a   Huang, Hui Hsiang ^a   Chiu, Chi Tsung ^b   Hung, Chih Pin ^b  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Integrated circuit packaging; Package effects; Package modeling techniques; Plastic packaging

Indexed keywords

INTEGRATED CIRCUIT PACKAGING;

ELECTRIC NETWORK ANALYZERS; EQUIVALENT CIRCUITS; HETEROJUNCTION BIPOLAR TRANSISTORS; INTEGRATED CIRCUITS; LOW PASS FILTERS;

CHIP SCALE PACKAGES;

EID: 0035446597     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.942564     Document Type: Article

References (12)

1. F. Ndagijimana, J. Engdahl, A. Ahmadouche, and J. Chilo, "Frequency limitation on an assembled SOP8 package," in Proc. 43rd Electron. Comp. Technol. Conf., 1993, pp. 530-535.
2. A. C. Cangellaris, J. L. Prince, and L. P. Vakanas, "Frequency- dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 13, pp. 154-159, Mar. 1990.
3. T. Y. Chou and Z. J. Cendes, "Capacitance calculation of IC packages using the finite element method and planes of symmetry," IEEE Trans. Computer-Aided Design, vol. 13, pp. 1159-1166, Sept. 1994.
4. R. W. Jackson, "A circuit topology for microwave modeling of plastic surface mount packages," IEEE Trans. Microwave Theory Tech., vol. 44, pp. 1140-1146, July 1996.
5. R. W. Jackson and S. Rakshit, "Microwave-circuit modeling of high lead-count plastic packages," IEEE Trans. Microwave Theory Tech., vol. 45, pp. 1926-1933, Oct. 1997.
6. Y. Chen, P. Harms, R. Mittra, andW. T. Beyene, "An FDTD-Touchstone hybrid technique for equivalent circuit modeling of SOP electronic packages," IEEE Trans. Microwave Theory Tech., vol. 45, pp. 1911-1918, Oct. 1997.
7. F. Mernyei, "Measurement and field simulation based characterization of plastic packages," in Proc. IEEE 6th Topical Elect. Performance Electron. Packag. Meeting, 1997, pp. 181-184.
8. T. S. Horng, S. M.Wu, and C. Shih, "Electrical modeling of RFIC packages up to 12 GHz," in Proc. 49th Electron. Comp. Technol. Conf., 1999, pp. 867-712.
9. T. S. Horng, S. M. Wu, J. Y. Li, C. T. Chiu, and C. P. Hung, "Electrical performance improvements on RFIC's using bump chip carrier packages as compared to standard small outline packages," in Proc. 50th Electron. Comp. Technol. Conf., 2000, pp. 439-444.
10. T. Itoh, "Spectral domain immitance approach for dispersion characteristics of generalized printed transmission lines," IEEE Trans. Microwave Theory Tech., vol. MTT-28, pp. 733-736, July 1980.
11. O. Fordham, "Two Layer Microstrip Transmission Lines," M.S. thesis, Dept. Elect. Eng., Univ. California at Los Angeles, Los Angeles, CA, 1987.
12. Y. Gobert, P. J. Tasker, and K. H. Bachem, "A physical, yet simple, small-signal equivalent circuit for the heterojunction bipolar transistor," IEEE Trans. Microwave Theory Tech., vol. 45, pp. 149-153, Jan. 1997.