An FDTD-touchstone hybrid technique for equivalent circuit modeling of SOP electronic packages

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 10 PART 2, 1997, Pages 1911-1918

  Chen, Yinchao ^a   Harms, Paul ^a   Mittra, Raj ^a   Beyene, Wendemagegnehu T ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Electronic packaging; Equivalent circuits; FDTD; Silicon on plastic (SOP) package

Indexed keywords

COMPUTER SOFTWARE; EQUIVALENT CIRCUITS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; TIME DOMAIN ANALYSIS;

SILICON ON PLASTIC PACKAGE;

ELECTRONICS PACKAGING;

EID: 0031249225     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.641790     Document Type: Article

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