Microwave-circuit modeling of high lead-count plastic packages

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 10 PART 2, 1997, Pages 1926-1933

  Jackson, Robert W ^a   Rakshit, Sambarta ^a  

^a University of Massachusetts   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC NETWORK TOPOLOGY; MATHEMATICAL MODELS; MEASUREMENTS; MICROWAVE CIRCUITS;

MATCHED TRANSITION;

ELECTRONICS PACKAGING;

EID: 0031246726     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.641792     Document Type: Article

References (6)

1. R. W. Jackson, "A circuit topology for microwave modeling of plastic surface mount packages," IEEE Trans. Microwave Theory Tech., vol. 44, pp. 1140-1146, July 1996.
2. R. W. Jackson and S. Rakshit, "Microwave modeling of an elevated paddle surface mount package," in IEEE Conf. Elect. Performance Electron. Packaging Proc., Napa Valley, Oct. 1996, pp. 57-62.
3. J. C. Rautio, "Synthesis of lumped models from JV-port scattering parameter data," IEEE Trans. Microwave Theory Tech., vol. 42, pp. 535-537, Mar. 1994.
4. F. W. Grover, Inductance Calculations: Working Formulas and Tables. New York: Dover, 1973.
5. R. H. Caverly, "Characteristic impedance of integrated circuit bond wires," IEEE Trans. Microwave Theory Tech., vol. MTT-34, pp. 982-984, Sept. 1986.
6. S. Rakshit, "Circuit models of surface mount packages," M.S. thesis, Dept. Elect. Eng. Comput. Sei., Univ. of Massachusetts, Feb. 1997.