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Volumn 180, Issue 1-2, 2001, Pages 6-13

The influence of chemical treatments on tungsten films found in integrated circuits

(7) Perry, Scott S a Galloway, Heather C b Cao, Paul a Mitchell, Evelynn J R b Koeck, Debbie C b Smith, Christopher L b Lim, Min Soo a

a University of Houston (United States)

b TEXAS STATE UNIVERSITY (United States)

Author keywords

Atomic force microscopy; Chemical mechanical planarization; Chemical mechanical polishing; Tungsten; Tungsten oxide; X ray photoelectron spectroscopy

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; CHEMICAL VAPOR DEPOSITION; COMPOSITION EFFECTS; ETCHING; MORPHOLOGY; TUNGSTEN; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMICAL MECHANICAL PLANARIZATION (CMP);

METALLIC FILMS;

EID: 0035426811 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/S0169-4332(01)00308-7 Document Type: Article

Times cited : (21)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.