General accuracy considerations of microwave on-wafer silicon device measurements

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2000, Pages 1839-1842

  Kolding, Troels Emil ^a  

^a AALBORG UNIVERSITY   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT RESISTANCE; LEAKAGE EFFECTS; MICROWAVE ON-WAFER MEASUREMENT; SILICON SUBSTRATES; SUBSTRATE COUPLING;

CMOS INTEGRATED CIRCUITS; ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DOPING; SILICON WAFERS; SUBSTRATES;

MICROWAVE MEASUREMENT;

EID: 0033724437     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)

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2. T. E. Kolding, On-Wafer Measuring Techniques for Characterizing RF CMOS Devices, Ph.D. thesis, RF Integrated Systems & Circuits (RISC) Group, Aalborg University, Niels Jernes Vej 12, 9220 Aalborg Øst, Denmark, August 1999.
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6. T. E. Kolding, "On-Wafer Calibration Techniques for GigaHertz CMOS Measurements," in Proceedings of IEEE International Conference on Microelectronic Text Structures (ICMTS), Gothenburg, Sweden, March 1999, pp. 105-110.
7. C.-H. Kim, C. S. Kim, H. K. Yu, and K. S. Nam, "An Isolated-Open Pattern to De-Embed Pad Parasitics," IEEE Microwave and Guided Wave Letters, vol. 8, no. 2, pp. 96-98, February 1998.
8. T. E. Kolding, "Impact of Test-Fixture Forward Coupling on On-Wafer Silicon Device Measurements," To appear in IEEE Microwave and Guided Wave Letters, 2000.
9. T. E. Kolding, "A 4-Step Method for De-Embedding Gigahertz On-Wafer CMOS Measurements," To appear in IEEE Transactions on Electron Devices in April 2000.