Impact of Test-Fixture Forward Coupling on On-Wafer Silicon Device Measurements

IEEE Microwave and Guided Wave Letters

Volumn 10, Issue 2, 2000, Pages 73-74

  Kolding, Troels Emil ^a  

^a AALBORG UNIVERSITY   (Denmark)

Author keywords

Calibration; integrated circuits; microwave mea; surements

Indexed keywords

BUILT-IN SELF TEST; ELECTRONIC EQUIPMENT TESTING; MOSFET DEVICES; SILICON WAFERS;

ON-WAFER DEVICE MEASUREMENT;

MICROWAVE INTEGRATED CIRCUITS;

EID: 0033682694     PISSN: 10518207     EISSN: None     Source Type: Journal    
DOI: 10.1109/75.843105     Document Type: Article

References (5)

1. T. E. Kolding, “On-wafer calibration techniques for giga-hertz CMOS measurements,” in Proc. IEEE Int. Conf. Microelectronic Test Structures (ICMTS), Gothenburg, Sweden, Mar. 1999, pp. 105-110.
2. C.-H. Kim, C. S. Kim, H. K. Yu, and K. S. Nam, “An isolated-open pattern to de-embed pad parasitics,” IEEE Microwave Guided Wave Lett., vol. 8, pp. 96-98, Feb. 1998.
3. C. E. Biber, M. L. Schmatz, T. Morf, U. Lott, and W. Bächtold, “A nonlinear microwaveMOSFET model for spice simulators,” IEEE Trans. Microwave Theory Tech., vol. 46, pp. 604-610, May 1998.
4. T. E. Kolding, “On-Wafer Measuring Techniques for Characterizing RF CMOS Devices,” Ph.D. Thesis, RF Integrated Systems & Circuits (RISC) Group, Aalborg University, 9220 Aalborg Øst, Denmark, Aug. 1999.
5. H. Cho and D. E. Burk, “Three-step method for the de-embedding of high-frequency S-parameter measurements,” IEEE Trans. Electron Devices, vol. 38, pp. 1371-1375, June 1991.