Process and electrical (modulator) efficiency of plasma immersion ion implantation

IEEE Transactions on Plasma Science

Volumn 29, Issue 3, 2001, Pages 529-535

  Tian, Xiubo ^b   Zeng, Xuchu ^a,b   Chu, Paul K ^a,b  

^a IEEE   (Hong Kong)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Plasma immersion ion implantation; Power modulator

Indexed keywords

ELECTRICAL EFFICIENCY; PLASMA IMMERSION ION IMPLANTATION; POWER MODULATOR;

CAPACITANCE; COMPUTER SIMULATION; CURRENT DENSITY; ELECTRIC POTENTIAL; ELECTRONS; ION BOMBARDMENT; ION IMPLANTATION; MODULATORS; PLASMA SHEATHS; SURFACE TREATMENT;

PLASMAS;

EID: 0035363368     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/27.928952     Document Type: Article

References (29)

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